Future Directions in Semiconductor Processing: Scaling, Integration, and the Sustainability Imperative
半導体プロセッシングの将来方向：スケーリング、集積化、そして持続可能性への要請 (AI 翻訳)
R. Al-Hassan, Edmund Dasori Azundow, Y. Sam-Okyere, Emmanuel Osei-Kwame, Nii Ayitey Freddie Aryee
🤖 gxceed AI 要約
日本語
2020〜2025年の半導体業界の進展をレビュー。FinFETからGAAへの移行、EUVリソグラフィ、チップレット統合などの技術革新と、高GWPガス排出や水消費などの持続可能性課題を分析。今後の成長は性能向上と環境配慮のバランスにかかると結論。
English
This review analyzes semiconductor industry advancements from 2020-2025, including FinFET-to-GAA transition, EUV lithography, and chiplet integration, alongside sustainability challenges like high-GWP gas emissions and water consumption. It concludes that future progress depends on balancing performance demands with environmental stewardship.
Unofficial AI-generated summary based on the public title and abstract. Not an official translation.
📝 gxceed 編集解説 — Why this matters
日本のGX文脈において
日本政府は半導体戦略をGX政策の柱に位置付け、国内工場の環境負荷低減が急務。本レビューは、半導体製造のカーボンフットプリント削減や水資源管理に関する重要な洞察を提供し、日本のグリーン半導体政策に示唆を与える。
In the global GX context
Globally, semiconductor sustainability is gaining attention under frameworks like the EU Chips Act and U.S. CHIPS Act, which include environmental provisions. This review highlights the industry's transition toward circular economy principles and reduced emissions, relevant for companies facing ESG disclosure and regulatory requirements.
👥 読者別の含意
🔬研究者:Provides a comprehensive overview of semiconductor processing trends and sustainability challenges, useful for identifying research gaps in green manufacturing.
🏢実務担当者:Offers insights into reducing operational costs through energy/water efficiency and managing supply chain risks in the semiconductor sector.
🏛政策担当者:Underlines the need for balancing innovation incentives with environmental regulations in national semiconductor strategies.
📄 Abstract（原文）
The global semiconductor industry has navigated a period of intense innovation and systemic challenges between 2020 and 2025. Driven by the exponential demands of Artificial Intelligence (AI), 5G/6G communication, and high-performance computing (HPC), the sector has pursued a dual strategy of continued transistor scaling and sophisticated heterogeneous integration. This review systematically analyzes the critical advancements and challenges within this period. We detail the fundamental architectural shift from FinFET to Gate-All-Around (GAA) transistors, enabling the 3-nanometer (nm) and 2-nm nodes, and the adoption of Extreme Ultraviolet (EUV) lithography for High-Volume Manufacturing (HVM). Concurrently, advanced packaging techniques, such as hybrid bonding and the standardization of chiplet architectures via the Universal Chiplet Interconnect Express (UCIe), have emerged as indispensable means to circumvent planar scaling limits. Economically, the industry has contended with escalating capital expenditure (CapEx) and the severe global chip shortage (2020–2023), prompting widespread government intervention, notably through the U.S. CHIPS Act and the EU Chips Act. Crucially, the review addresses the intensifying sustainability mandate, examining the challenges posed by high-Global Warming Potential (GWP) gas emissions, soaring water consumption, and the necessary transition toward circular economy principles within the fabrication environment. The findings underscore that future progress is contingent upon balancing relentless performance demands with resilient supply chains and comprehensive environmental stewardship.
🔗 Provenance — このレコードを発見したソース
- semanticscholar https://doi.org/10.62777/aeit.v3i1.97first seen 2026-06-10 05:14:19 · last seen 2026-06-16 05:01:37
🔔 こうした論文の新着を逃したくない方は キーワードアラート に登録（無料・3キーワードまで）。
gxceed は公開メタデータに基づく研究支援データセットです。要約・翻訳・解説は AI 支援で生成されています。 最終的な解釈・検証は利用者が原典資料に基づいて行うことを前提とします。